What is PCB rosin process?
What is PCB rosin process-- ONESEINE
Rosin on PCB surface treatment, also known as flux, is a surface treatment done by PCB circuit board factories during the post processing of PCBs. Its function is to facilitate customer SMT and plug-in processing in the later stage. It is a product with low board formation and high efficiency. Early rosin technology was mainly used for single-sided PCB boards, with materials such as 22F, FR-1, CEM-1, etc. Mostly used for small home appliance circuit boards.
The rosin process has three main functions:
1. Remove the oxide film. The essence is that the substances in the flux undergo a reduction reaction, thereby removing the oxide film, and the reaction products become suspended slag, floating on the surface of the solder.
2. Prevent oxidation. After melting, it floats on the surface of the solder, forming an isolation layer, thus preventing oxidation of the welding surface.
3. Reduce surface tension, increase solder flowability, and help solder wet solder components
The above is what rosin process is and the application of rosin process. With the passage of time, the improvement of electronic products and new requirements, it will gradually be changed to a more environmentally friendly OSP antioxidant process.
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