High-quality aluminum-based PCB circuit board customization service

High-quality aluminum-based PCB circuit board customization service

Aluminum substrate is a metal-based copper-clad plate with good heat dissipation function. Generally, a single-sided board consists of a three-layer structure, namely a circuit layer (copper foil), an insulating layer and a metal base layer. There are also designs for high-end use as double-sided boards, with a structure of circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer. Very few applications are multi-layer boards, which can be made by laminating ordinary multi-layer boards with insulating layers and aluminum bases.

Single-sided aluminum substrate: There is only one conductive graphic layer and insulating material plus aluminum plate (substrate)

Double-sided circuit aluminum substrate: There are two layers of conductive graphic layers and insulating material plus aluminum plate (substrate) superimposed together.

Multi-layer printed aluminum-based circuit board: A printed circuit board made of three or more layers of conductive graphic layers and insulating materials plus aluminum plates (substrates) alternately laminated and bonded together.

Classification by surface treatment method:

Immersion gold board (chemical thin gold, chemical thick gold, selective immersion gold)

Electrical gold board (full board electroplating, gold finger, selective electroplating)

Spray tin board, molten tin board, immersion tin board, immersion silver board, electroplated silver board, immersion palladium board

Advantages of aluminum substrate

(1) Heat dissipation is significantly better than the standard FR-4 structure.

(2) The thermal conductivity of the dielectric used is usually 5 to 10 times that of conventional epoxy glass, and the thickness is only one-tenth.

(3) The heat transfer index is more efficient than traditional rigid PCB.

(4) A lower copper weight can be used than shown in the IPC recommended diagram.

Application areas of aluminum substrate

Aluminum substrate uses: power hybrid IC (HIC). Audio equipment input, output amplifier, balanced amplifier, audio amplifier, preamplifier, power amplifier, etc.

Power supply equipment: switching regulator, DC/AC converter, SW regulator, etc.

Communication electronic equipment: high-frequency amplifier, filter electrical appliance, transmission circuit.

Office automation equipment: motor driver, etc.

Automobile: electronic regulator, igniter, power controller, etc.

Computer: CPU board, floppy disk drive, power supply unit, etc.

Power module: inverter, solid relay, rectifier bridge, etc.

Lamps and lanterns: With the promotion of energy-saving lamps, various energy-saving and gorgeous LED lamps are very popular in the market, and aluminum substrates used in LED lamps have also begun to be used on a large scale.

Aluminum substrate performance

Heat dissipation

At present, many double-sided boards and multi-layer boards have high density and high power, and it is difficult to dissipate heat. Conventional printed circuit board substrates such as FR4 and CEM3 are poor conductors of heat, with insulation between layers, and heat cannot be dissipated. If local heating of electronic equipment is not eliminated, electronic components will fail at high temperature, and aluminum substrates can solve this heat dissipation problem.

Thermal expansion

Thermal expansion and contraction are the common nature of matter, and the thermal expansion coefficients of different substances are different. Aluminum-based printed circuit boards can effectively solve the heat dissipation problem, thereby alleviating the thermal expansion and contraction problems of different materials of components on the printed circuit board, and improving the durability and reliability of the whole machine and electronic equipment. Especially to solve the problem of thermal expansion and contraction of SMT (surface mount technology).

Dimensional stability

Aluminum-based printed circuit boards are obviously much more stable in size than printed circuit boards made of insulating materials. Aluminum-based printed circuit boards and aluminum sandwich panels, heated from 30℃ to 140-150℃, have a dimensional change of 2.5-3.0%.

Other reasons

Aluminum-based printed circuit boards have a shielding effect; replace brittle ceramic substrates; use surface mounting technology with confidence; reduce the truly effective area of printed circuit boards; replace components such as radiators, improve product heat resistance and physical properties; reduce production costs and labor.

Aluminum substrates can be divided into: tin-sprayed aluminum substrates, anti-oxidation aluminum substrates, silver-plated aluminum substrates, gold-immersion aluminum substrates, etc. according to the process; ****

According to the use, they can be divided into: street lamp aluminum substrates, fluorescent lamp aluminum substrates, LB aluminum substrates, COB aluminum substrates, packaged aluminum substrates, bulb aluminum substrates, power aluminum substrates, automotive aluminum substrates, etc. ****

Special testing methods for aluminum-based copper-clad laminates:

The first is the dielectric constant and dielectric loss factor measurement method, which is a variable Q value series resonance method. The sample and the tuning capacitor are connected in series to the high-frequency circuit to measure the Q value of the series circuit;

The second is the thermal resistance measurement method, which is calculated by the ratio of the temperature difference between different temperature measurement points to the heat conductivity.