How much do you know about the advantages of nickel-palladium-gold process for PCB circuit boards?

How much do you know about the advantages of nickel-palladium-gold（ENEPIG） process for PCB circuit boards?

Compared with other surface processes, the nickel-palladium-gold process (ENEPIG) has the following advantages:

1. Prevent the occurrence of "black nickel problem" and prevent the corrosion of nickel by replacement gold.

2. Palladium has high hardness, and chemical palladium plating will act as an isolation layer to prevent poor welding caused by copper contamination in the plating layer.

3. The nickel-palladium-gold process can withstand multiple lead-free reflow cycles.

4. The nickel-palladium-gold process has excellent bonding gold wire bonding, and SSOP, TSOP, QFP, TQFP, PBGA and other packaging components are suitable for this surface process.

5. The palladium plating layer is completely dissolved in the solder, and when the chemical palladium plating is dissolved, the chemical nickel plating layer will be exposed, forming a good nickel-tin alloy with good solderability and adhesion.

Metric:

1um (micrometer) = 39.37uinch (microinch)

1cm (centimeter) = 10mm (millimeter)

1mm = 1000um

English:

1ft (foot )=1000mil(mil)=1000000uinch(microinch)

1ft(foot)=12inch(inch) 1inch=25.4mm

1ft=0.3048m 1mil=25.4um=1000uinch

uinch, as mentioned above, is pronounced mai, and is represented by u''.