News
Multilayer PCB Manufacturing Capabilities multilayer pcb manufacturing machines
Multilayer PCB Manufacturing Capabilities
PCB layers:4 to 60
Build time:1 day to 4 weeks
Final board thickness:0.15mm to 3.2mm
Materials:FR4, polyimide, aluminum, ceramics, PTFE
Tg (FR4 multilayer PCB):135°C, 150°C, 160°C, 170°C, 180°C, 185°C...
Aspect Ratio:(laser drill) 3:4 (PTH) 10:1
Min. drill bit size:8mil
HDI stackup
1+N+1, 2+N+2, 3+N+3 (with copper filling)
Line/space
(inner layers)2.5mil/2.5mil
(external layers)2.5mil/2.5mil
Copper thickness:1/3oz to 6oz
Warpage:0.5%
Punching profile:±3mil
Applications of Multilayer PCBs
● Computers, telecommunication
● Industrial controls, automotive
● Defense & aerospace systems
● Medical equipment
● Consumer electronics, etc.