Application of Multilayer PCB Circuit board

Application of Multilayer PCB Circuit board

The production method of the multi -layer plate is generally made by the inner layer, and then the printing method is made into a single or double -sided substrate, and it is incorporated into the specified layer, and then it is heated, pressed and bonded. The holes are the same as the coating method of the double panel. It was invented in 1961.

1. What is a multi -layer line board

Multi -layer circuit boards, as famous as the name, are two or more circuit boards can be called multi -layer, such as four layers, six layers, eight layers, and so on. Of course, some designs are three or five -layer lines, also called multi -layer PCB line boards. The conductive ride diagram greater than the second -layer board has an insulation substrate between the layers. After each layer of the line is printed, the lines of each layer are overlapped by pressing the collusion. Then drill the hole to achieve the turnover between each layer of the line. The advantage of the multi -layer PCB line board is that the line can be distributed in the multi -layer wiring, so that it can design more precise products. Or smaller products can be achieved through multi -layer boards. Such as: mobile line board, micro projectors, recording pens and other products. In addition, multi -layers can increase the flexibility of design, better control the differential impedance and single -end impedance, as well as the output with better signal frequency.

2. Features of multi -layer line boards

Advantages of multi -layer line boards: high assembly density, small volume, and light quality Due to the high assembly density, the connection between each component (including components) decreases, so it increases reliability; it can increase the number of wiring layers, thereby increasing the design Flexibility; can constitute circuits with certain impedance; can form a high -speed transmission circuit; the circuit and magnetic circuit shielding layer can be set, and the metal core heat dissipation layer can be set to meet special functions such as shielding and heat dissipation; it is simple and highly installed and high. Disadvantages: high cost; long cycle; detection methods with high reliability.

Multi -layer printing circuit is a product of electronic technology developing to the development of high -speed, multifunctional, large -capacity, and small volume direction. With the continuous development of electronic technology, especially the widespread and in -depth application of large -scale and large -scale integrated circuits, multi -layer printing circuits are rapidly developing in high density, high -precision, and high -level digital direction. , Blind hole buried holes, high -board thick pore diameter and other technologies to meet the needs of the market.

3. Application of multi -layer circuit board

The market of the circuit board sector is constantly developing, which is mainly due to the two aspects of the motivation. First, the market space of the line board sector application industry is continuously expanding, and the application of the communication industry and the laptop industry has increased, making the high -end multi -layer line board market grow very rapidly, and the current application ratio has reached 50%. At the same time, the proportion of color TV, mobile phones, and automotive electronics has also increased significantly, which has continuously expanded the space of the circuit board industry. Furthermore, the global line board industry is moving towards country has also led to the rapid expansion of my country's line board market space. Recently, the income data announced by the PCB special manufacturer (PCB Pure-PLAYS) revealed a market environment with a growing demand: in the past year, PCB's order shipment ratio is greater than one. On the other hand, due to the fierce competition in the PCB industry, some PCB manufacturers have actively developed new technologies, increasing the number of PCB layers or promoting the market -oriented process of high technical requirements to meet the changing market demand; at the same time, through technology, through technology The "suppression" on the upper side has forced some small factories to withdraw from the market. This is also the hidden concern of a large part of the PCB factory under the good situation of this year.

As the application scope of the circuit board sector is getting wider and wider, FPCs in the fields of computers and communications, consumer electronics, automobiles, military and aerospace, and medical care are being used in large quantities. Therefore, market demand has increased significantly. According to the dealer's report, this year's FPC shipments are also significantly higher than in previous years. With the continued maintenance of gross profit margins, dealers have shown confidence in focusing on the market.