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PCB BGA information

The outer line of the PCB BGA production:

BGA can refer to specifications, design pad size corresponding to the position of a customer to make a standard design BGA BGA array, and then as its benchmarks to be corrected under the BGA and BGA vias were being shot, to be filmed after the original is not shoot before the backup check the level of contrast before and after being shot effect, if BGA pad around large deviations, can not only beat BGA position over the next hole.
BGA stands for Ball Grid Array (PCB ball grid array structure), it is a large, pin package assembly, four pin QFP and similar, are using SMT solder paste to the circuit board is connected. Their differences are listed in the surrounding "space was the" single-row pin, such as gull wing room to move, room to move flat or retracted abdomen and foot end of the J-; changed to the bottom belly full array or an array of local, the adoption of a two dimensional area of the solder ball pinout, as the chip package on the circuit board solder interconnection tools. It has an area of less packaging, increased functionality, increased pin count, high reliability, good electrical properties, low overall cost.

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