PCB Assembly information
ONESEINE manufacturing Services Including Blows:
v Fast PCB Fabrication for Samples and Mass Production
v Electronic Components Sourcing Services
v PCBA Assembly Services:SMT,DIP,BGA...
v Function Test
v Stencil,Cable and Enclosure Assembly
v Reverse engineering service
v Standard Packing and On time Deliv
Continuous process improvement:
Excellent impedance control
Measuring impedance 100% before shipment
Excellent board thickness control
Measuring board thickness 100% by laser after lamination;
Measuring board thickness 100% before shipment;
Inspection by AOI after Inner and outer layer
AVI for key products
Technical Requirement for PCB Assembly:
Professional Surface-mounting and Through-hole soldering Technology
Various sizes like 1206,0805,0603,0402,0201 components SMT technology
ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
PCB Assembly With UL,CE,FCC,Rohs Approval
Nitrogen gas reflow soldering technology for SMT.
High Standard SMT&Solder Assembly Line
High density interconnected board placement technology capacity.
PCB Assembly Manufacturing Procedures:
Program Management
PCB Files → DCC → Program Organizing → Optimization → Checking
SMT Management
PCB Loader → Screen Printer → Checking → SMD Placement → Checking → Air Reflow → Vision Inspection → AOI → Keeping
PCBA Management
THT→Soldering Wave (Manual Welding) → Vision Inspection → ICT → Flash → FCT → Checking → Package → Shipment
What's our PCBA manufacturing productivity?
SMT Workshop (8 complete automatic SMT lines: 6 million points/day )
• Automatic loader
• Solder paste printer
• SMT chip mounter
• Reflow oven
• AOI(Automatic Optical Inspection)
• BGA rework
•
DIP Workshop (2 DIP production lines: 0.4 million points /day )
• Wave Soldering oven
• Manual insertion flow line
Manual Soldering (2 Hand soldering lines: 0.10 million points/day)
• Manual soldering lines
• Electronic soldering iron in soldering operation