What are the application scenarios for blind and buried via PCB circuit boards?

What are the application scenarios for blind and buried via PCB circuit boards?

Blind and buried via circuit boards are the core of high-end electronic devices. Their high-density interconnects and optimized signal integrity enable performance leaps in fields such as 5G communication, automotive electronics, and smartphones.

In the field of 5G communication, they serve as the "nerve center" of base stations and optical modules. Through blind and buried via technology, signal transmission paths are shortened by 30%-50%, and transmission losses are as low as 0.3dB/cm@28GHz, ensuring stable transmission of high-frequency signals and enabling stable operation of 5G devices.

In the field of automotive electronics, they support the future of intelligent driving and electrification. With the surge in the number of electronic devices in vehicles, blind and buried via technology improves the reliability and stability of circuit boards, reduces signal interference, and ensures driving safety.

In the field of smartphones, they enable devices to be thinner, lighter, and more powerful. Blind and buried via technology supports 0.4mm pitch BGA packaging, increasing wiring density by 20%, allowing the motherboard thickness of foldable phones to be reduced to 0.25mm, while integrating key components such as processors, memory, and cameras.

Furthermore, in medical devices, it helps achieve device miniaturization and high-precision signal acquisition; in the field of artificial intelligence, it provides reliable support for the massive data processing of AI chips. These applications all benefit from the high-density wiring, low signal interference, and excellent reliability brought by blind via technology.