DK2.2 Arlon 880 HF PCB printed circuit board Fabrication
General Information:
Name:HF HIGH FREQUENCY PCB board
Dielectric constant:2.2(alternative material:TLY-5,RT5880,NY9220)
Material:Arlon 880 1.524mm
Layer:2
Surface finish:ENIG
Copper weight:1OZ
Finished board thickness:1.6mm
Type: PCB prototype
Board size:12*15cm
Quantity:15 pcs
Delivery time: 7 days
HF PCB Application:
• Military Radar Feed Networks
• Commercial Phased Array Networks
• Low Loss Base Station Antennas
• Missile Guidance Systems
• Digital Radio Antennas
• Filters, Couplers, LNAs
HF Material Selection:
Brand |
Model |
Thickness(mm) |
DK(ER) |
Rogers |
RO4003 |
0.203, 0.5、0.813、1.524 |
3.38 |
RO4350 |
0.168,0.254 0.508、0.762、1.524 |
3.5 |
|
RO4360G2 |
0.61,1.524 |
6.15 |
|
RT5880 |
0.254.0.508.0.787 |
2.2 |
|
RO3003 |
0.127,0.254,0.508,0.762,1.524 |
3 |
|
RO3010 |
0.635 |
10.2 |
|
RO3006 |
0.254 |
6.15 |
|
RO3206 |
0.635MM |
10.2 |
|
R03035 |
0.508MM |
3.5 |
|
RT6010 |
0.635MM, 1,27MM |
10.2 |
|
TACONIC |
TLX-8.TLX-9 |
0.508. 0.762 |
2.45-2.65 |
TLC-32 |
0.254、0.508,0.762 |
3.35 |
|
TLY-5 |
0.254、0.508.0.8、 |
2.2 |
|
RF-60A |
0.254.0.508.0.762 |
6.15 |
|
CER-10 |
0.254.0.508.0.762 |
10 |
|
RF-30 |
0.254.0.508.0.762 |
3 |
|
TLA-35 |
0.8 |
3.2 |
|
ARLON |
AD255C06099C |
1.5 |
2.55 |
MCG0300CG |
0.8 |
3.7 |
|
AD0300C |
0.8 |
3 |
|
AD255C03099C |
0.8 |
2.55 |
|
AD255C04099C |
1 |
2.55 |
|
Diclad880 |
0.762,1.524mm |
2.2 |
|
DLC220 |
1 |
2.2 |
|
F4B |
F4B |
0.38 |
2.2 |
F4B |
0.55 |
2.23 |
|
F4B |
0.225、0.3、0.5、08、1、1.2、1.5、2、2.5、3.0 |
2.65 |
|
F4Bk |
0.8、1.5 |
2.65 |
|
F4B |
0.8 |
3.5 |
|
FE=F4BM |
1 |
2.2 |
The basic characteristics of high-frequency PCB substrate materials:
1, the dielectric constant (Dk) must be small and very stable, usually the smaller the better signal transmission rate and the material is inversely proportional to the square root of the dielectric constant, high dielectric constant susceptible to signal transmission delay.
2,Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.
3,And in accordance with copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.
4,Water absorption is low, high water absorption will affect the dielectric constant when the damp and dielectric loss.
5,Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Contact: Ms Tracy
Phone: 0086 18682010757
Tel: 0086 18682010757
Add: BludingA,Shixiaganglian Industrial Park,Shajing,Baoan,Shenzhen,China