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  • 2 Layer Rogers 4350B PCB With Rigid ENEPIG Gold Electroless Nickel
2 Layer Rogers 4350B PCB With Rigid ENEPIG Gold Electroless Nickel

2 Layer Rogers 4350B PCB With Rigid ENEPIG Gold Electroless Nickel

  • ENEPIG Gold
  • Electroless Nickel
  • 2 Layer
  • 4350B 0.508mm
  • Product description: copper pcb pcb fabrication assembly pcb fabrication quote hdi pcb manufacturer printed circuit board production pcb manufacturing quote pcb board online best pcb pcb card flex pcb board prin
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2 Layer Rogers 4350B PCB With Rigid ENEPIG Gold Electroless Nickel


Basic information:

Name:Antenna high frequency antenna amplifier

Board size:19*12CM

Surface finish:ENEPIG

Solder mask:Blue

Silkscreen:White

Material:Rogers 4350B 0.508mm


What does ENEPIG mean?

ENEPIG is the abbreviation of chemical nickel plating chemical palladium immersion gold, which is a ceramic PCB surface treatment technology widely used in the electronics manufacturing industry. The following is a detailed explanation of ENEPIG:

1. The basic concept of ENEPIG

ENEPIG, the full name is Electroless Nickel Electroless Palladium Immersion Gold, which means chemical nickel plating, chemical palladium plating, and immersion gold. This is an advanced surface treatment process, mainly used to improve the conductivity, corrosion resistance and solderability of ceramic PCBs (printed circuit boards).

2. The process flow of ENEPIG

Chemical nickel plating: First, a layer of nickel is deposited on the surface of the ceramic PCB by chemical methods. This layer of nickel not only has good conductivity, but also provides a solid foundation for subsequent plating.

Chemical palladium plating: Then, a layer of palladium is deposited on the nickel layer. The palladium layer has excellent corrosion resistance and solderability, which can protect the nickel layer from erosion by the external environment and improve the reliability during welding.

Immersion gold: Finally, the treated ceramic PCB is immersed in a gold solution to attach gold ions to the surface of the palladium layer. The gold layer not only has excellent conductivity, but also can further improve the corrosion resistance and solderability of the ceramic PCB.

III. Application advantages of ENEPIG

Improve conductivity: By depositing three layers of metal, nickel, palladium and gold, ENEPIG can significantly improve the conductivity of ceramic PCBs and ensure the stable transmission of electronic signals.

Enhance corrosion resistance: Both the palladium layer and the gold layer have excellent corrosion resistance, which can protect the ceramic PCB from erosion in harsh environments such as moisture and salt spray, and extend its service life.

Improve solderability: The gold layer has good solderability, which can ensure that the ceramic PCB forms a good connection with the components during the welding process, and improve the welding quality and reliability.

In summary, ENEPIG, as an advanced ceramic PCB surface treatment technology, has significant advantages in improving conductivity, corrosion resistance and solderability, so it has been widely used in the electronics manufacturing industry.

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