FPC mobile phone design production requirements

FPC mobile phone design production requirements

1. Design material selection

The first step is important. If the customer does not reflect or specify what substrate is used, it should consider pressing the copper, because its bending resistance is better than that of electrolytic copper. However, the substrate has a great impact on the performance of the bending performance of the substrate. Generally speaking, the bending resistance of the non -glue substrate is better than the bending resistance of the glue substrate.

Classification of substrate:

1.1 copper foil:

1.1.1 Press the copper.

Pressive copper is melted into a strip -shaped electrolytic cathode copper, which is formed by delay pressure. Because of the melting, the ingredients are evenly distributed by a single and crystalline distribution. Because the crystallization direction is parallel to the soft plate, it is suitable for the transmission of signals with high frequency. Pressing copper characteristics is better than electrolytic copper. Its thickness is 1/4oz, 1/3oz, 1/2oz, 1OZ, 2OZ.

1.1.2 electrolytic copper:

The electrolytic copper foil uses the principle of electroplating to deposit copper ions on the smooth cathode drum wheel of rotating, and then separate the copper foil from the cathode wheel to obtain copper foil with light surface and hair surface. It can be used after surface treatment. The contact surface of the electrolytic copper foil and the cathode drum is very smooth, but the other side will be rough under high current density due to contact with plating solution. This rough surface can increase the surface contact area after the surface treatment, which is conducive to improving the attachment of the protective film. Its thickness is 1/4oz, 1/3oz, 1/2oz, 1OZ, 2OZ.

Pi (polyimide), PET (polyte) or GE (glass fiber) are often used. Among them, PI performance is the best and the price is higher. The thickness is 1/2mil, 1mil, 2mil.

1.3 Select material matching when designing

Due to the high performance requirements of the slider mobile phone, both the material and the CVL should be considered in the direction of "thin".

1.4 Design typesetting

1.4.1 Bend regional line requirements:

a) Do not have a hole in the bending part;

b) Protect the copper lines on the two most of the line. If the space is insufficient, you should choose to add the inner R corner to protect the copper wire in the curved part;

c) The connection part in the line needs to be designed as a arc.

1.4.2 Bending area (AirGAP) requirements: The bending area needs to be layered to remove the glue to facilitate the function of dispersing stress. The larger the bending area, the bigger the better.