Summary of common problems and solutions for printed circuit board paste dry film

Summary of common problems and solutions for printed circuit board paste dry film

With the continuous development of the electronics industry and the continuous upgrading of products, in order to save the space of the circuit board, many circuit boards have been designed with very small lines. The previous wet film can no longer meet the current graphics transfer process. Nowadays, small lines are generally produced with dry film, so what problems do we have in the process of filming? The editor of Zhongke Circuit Board Factory will introduce it below.

Summary of common problems and solutions for PCB circuit board paste dry film

01Bubble appears between the dry film and the surface of the copper foil

Bad problem: Choosing a flat copper foil is the key to ensuring no bubbles.

Solution: Increase the pressure of the PCB circuit board film, and the board should be handled gently.

Bad problem: The surface of the heat press roller is uneven, there are pits and the film is dirty.

Solution: Regularly check and protect the flatness of the hot pressing roller surface.

Bad problem: PCB circuit board film temperature is too high, causing some contact materials to produce wrinkles due to temperature differences.

Solution: reduce the temperature of the PCB circuit board film.

02Dry film wrinkles

Bad problem: The dry film is too sticky, so carefully place the board during the operation.

Solution: Once contact occurs, it should be dealt with in time.

Bad problem: PCB circuit board is overheated before filming.

Solution: The preheating temperature of the circuit board should not be too high.

03The dry film is not firmly attached to the copper foil

Bad problem: The surface of the copper foil is not properly cleaned, and the direct operation will leave oil stains or oxide layers.

Solution: Wear gloves to wash the plate.

Bad problem: The quality of the dry film solvent is not up to standard or has expired.

Solution: The circuit board manufacturer should choose high-quality dry film and check the shelf life of the dry film regularly.

Bad problem: fast transmission speed, low temperature of PCB circuit board film.

Solution: Change the filming speed of PCB circuit board and the filming temperature of PCB circuit board.

Bad problem: The humidity in the processing environment is too high, which leads to prolonged dry film bonding time.

Solution: Keep the relative humidity of the production environment at 50%.

04 more glue

Bad problem: poor quality of dry film.

Solution: Replace the dry film.

Bad problem: the exposure time is too long.

Solution: Have an understanding of the materials used and carry out a reasonable exposure time.

Bad problem: the developer is ineffective.

Solution: Change the developer.