HDI PCB circuit board production process

HDI PCB circuit board production process

HDI circuit board is a multi-layer circuit board with a complex internal layout, which usually requires the use of high-density interconnection technology. The production process of HDI circuit board is very cumbersome and complex, and it is necessary to pay attention to various details in order to produce stable and reliable high-quality HDI circuit boards.

1. Raw material preparation

The raw materials needed for the manufacture of HDI circuit boards mainly include nickel copper foil, multi-layer thin plates, prepregs, etc. When preparing raw materials, it is necessary to select and purchase them according to actual production needs, and conduct necessary tests and inspections on the raw materials to ensure that their quality meets the requirements.

2. Outer layer circuit diagram design and production

First, it is necessary to design the outer layer circuit diagram, and select the board type and confirm the area according to the design. Then, copper plating is carried out, and processes such as photolithography, stripping and etching are carried out to complete the production of the outer layer circuit.

3. Design and production of inner circuit diagram

The inner circuit diagram is the same as the outer circuit diagram, the difference is that the inner circuit needs to be aligned, bonded, pre-pressed, copper plated, photolithography, stripping and etching to complete.

4. Design and production of printed circuit board

printed circuit board refers to the basic structure and support of HDI circuit board. The design of printed circuit board needs to be laid out and pressed according to the requirements to ensure that the HDI circuit board can work stably and reliably. Then, press, slot, integrate and polish to form a complete printed circuit board.

5. Manufacture of multi-layer circuit board

According to the design, multi-layer circuit boards are combined to complete the connection between inner and outer circuits. Then, copper plating, semi-curing, pre-pressing, drilling, plug-in, copper pressing, milling, sheet metal, bare board etching, pre-preg coating, drying and other processes are carried out to form a complete multi-layer circuit board.

6. Surface treatment and testing

Surface treatment and testing of the complete HDI circuit board. Surface treatment includes gold/silver/tin plating on the board surface to enhance the conductivity and corrosion resistance of the board surface; testing includes electrical performance testing, appearance testing, reliability testing, etc. to ensure that the HDI circuit board can operate normally.

In summary, the production process of HDI circuit boards is a complex and sophisticated process involving multiple key technologies and links. By continuously optimizing and improving these processes, manufacturers can meet the market demand for high-performance, low-cost products while ensuring product quality.