From resin plugging to electroplating filling,the development of PCB rapid prototyping hole filling technology

From resin plugging to electroplating filling,the development of PCB rapid prototyping hole filling technology

In the field of PCB manufacturing, the hole filling process is a seemingly small but crucial technology. This process achieves high-density interconnection and reliable electrical connection by filling conductive or insulating materials in the through-holes of PCB, providing a solid guarantee for the miniaturization and high performance of modern electronic products. Today, the editor of Jieduobang will talk to you about PCB hole filling, let's take a look.

The core value of the hole filling process lies in solving the problem of high-density interconnection. As electronic products develop towards thinness and shortness, the wiring space on PCB is becoming increasingly tight. Traditional through-holes take up a lot of space, and the hole filling technology provides more available space for surface mount components by filling the through-holes. This technological breakthrough enables PCB designers to achieve more complex circuit layouts in a limited space, meeting the needs of modern electronic products for high integration.

The improvement of PCB performance by the hole filling process is reflected in many aspects. Conductive hole filling can reduce the parasitic inductance of the through-hole and improve the transmission quality of high-frequency signals; insulating hole filling can enhance the mechanical strength of the PCB and prevent the hole wall from cracking due to thermal stress. In high-end products such as HDI boards and IC substrates, the via filling process is an indispensable key technology. For example, in smartphone motherboards, the via filling technology realizes an interconnection structure of up to a dozen layers, ensuring high-speed and stable transmission of signals.

The development of the via filling process has witnessed the progress of PCB manufacturing technology. From the initial resin plugging to today's electroplating via filling, from simple single-sided via filling to complex arbitrary layer interconnection, the via filling technology continues to break through the process limits. At present, the combination of laser drilling and electroplating via filling makes it possible to fill micro-holes with a hole diameter of less than 100 microns, paving the way for the development of the next generation of electronic products.

The development of this precision process reflects the electronics manufacturing industry's unremitting pursuit of perfection. In the millimeter-level space, the via filling process achieves the perfect unity of materials, equipment and processes, showing the precision beauty of modern manufacturing. The editor of Jieduobang believes that with the development of emerging technologies such as 5G and the Internet of Things, the via filling process will continue to promote PCB manufacturing technology to a higher level.