What is the reason for PCB delamination and foaming? How to prevent PCB ink foaming?

What is the reason for PCB delamination and foaming? How to prevent PCB ink foaming?

There are two types of quality issues with PCB blistering and delamination: one is blistering inside the board factory, and the other is blistering during SMT reflow soldering by customers.

Let's first talk about the first type, which is the discovery of layered bubbles in the board factory:

1. Insufficient surface treatment before wiring, insufficient concentration of liquid medicine in the cylinder, and oxidation phenomenon on the board surface after treatment are the main reasons for foaming.

2. There is water accumulation on the surface of the solder mask before welding

3. No rack inserted after development

4. When forming, the gong board burns the board, and the gong machine lifts the knife unevenly with the board

5. When spraying tin, the temperature is too high and the time is too long.

Layered foaming during customer use:

When dealing with such quality issues, Mr. Li mostly found that the delamination bubbles on the client side were mostly caused by plugins, high reflow soldering temperature, long tin immersion time, and uneven temperature. Most new employees are most prone to this negative phenomenon.

The above are some of the main reasons for delamination and blistering on PCB boards, as well as improper electroplating treatment. Therefore, delamination and blistering should be analyzed according to the corresponding quality.