High frequency and high-density, green breakthrough - multidimensional breakthrough of PCB technology drives AI and new energy vehicle transformation

High frequency and high-density, green breakthrough - multidimensional breakthrough of PCB technology drives AI and new energy vehicle transformation

The PCB technology field has recently shown multiple breakthroughs and deep integration, driven by advanced packaging, high-frequency materials, and green manufacturing, driving continuous innovation in the industry. The Chiplet architecture jointly promoted by TSMC and AMD requires ultra-high density interconnection for PCB boards. The ultra-thin copper foil processing technology developed by Shin Kong Electric in Japan compresses the line width/spacing to below 10 μ m, significantly improving signal transmission efficiency; Samsung Electric announced the mass production of 600mm × 600mm large-sized FOPLP substrates by 2024, with a cost reduction of 30% compared to traditional packaging, providing a cost-effective solution for AI chips and car processors. In terms of high-frequency materials, Rogers has launched CuClad ®  The 8000 series substrate supports millimeter wave communication above 110GHz with a loss factor as low as 0.0015. Panasonic's nano ceramic filled PTFE material solves the problem of high-frequency board warping through optimized thermal expansion coefficient, while Shengyi Technology's Syan series LCP substrate accelerates the landing of 5G base stations and laser radar applications with Dk=2.4. At the manufacturing process level, Pengding Holdings' 20 μ m line width mSAP technology has increased the yield of the iPhone 15 series LCP antenna to 95%. Orbotech's 12 μ m resolution LDI equipment has increased the efficiency of ultra-fine line processing by 40%. The foldable equipment has spawned 12 layer ultra-thin flexible PCBs (thickness 0.2mm, bending resistance 200000 times) and transparent polyimide based FPCBs (light transmittance>90%), which are redefining the form of consumer electronics. In the green transformation, Sumitomo Electric Wood's plant-based epoxy resin reduces its carbon footprint by 50%, and SMS Group's electrolysis ultrasonic combined recycling process in Germany achieves 99.9% high-purity copper extraction, promoting the implementation of circular economy. AI servers and new energy vehicles have become key battlefields. The Nvidia H100 GPU is equipped with a 16 layer ultra thick copper PCB (copper thickness ≥ 3oz) that supports a 20kW level heat dissipation design. Huawei's 3D stacked architecture reduces latency by 30% through vertical interconnection. Bosch's 2500V withstand voltage standard drives Jingwang Electronics to develop ceramic filled resin substrates to improve insulation performance by three times. Chinese companies are accelerating the breakthrough of technological barriers, Shennan Circuit has completed the domestic substitution of ABF carrier boards, Dazu Laser's high-precision CO ₂ laser drilling machine has achieved ± 5 μ m aperture accuracy, and Guanghua Technology's 5G high-frequency copper foil roughness has exceeded 1.5 μ m. However, the industry still faces dual challenges of 3nm carrier board defect rate control (<10ppb) and high-frequency material cost (LCP price exceeds FR-4 by twenty times). Technological breakthroughs and industrialization balance have become the focus of the next stage.