HDI blind buried via circuit board production process flow

HDI blind buried via circuit board production process flow

HDI blind buried via circuit board

The production process flow of HDI blind buried via circuit board is a complex process involving multiple key steps and technologies. The following is the production process flow of HDI blind buried via circuit board sorted out according to the search results provided:

1. Material preparation and design

First, it is necessary to prepare the raw materials required for manufacturing HDI blind buried via circuit boards, such as nickel copper foil, multilayer thin plates, prepregs, etc. Then, the outer layer circuit diagram is designed, and the board selection and area confirmation are carried out according to the design. The inner layer circuit diagram is the same as the outer layer circuit diagram, but the inner layer circuit needs to be aligned, bonded, pre-pressed, copper plated, photolithography, stripping and etching to complete.

2. Drilling

The drilling process of HDI blind buried via circuit board is an important part of its production process. According to the search results, there are two main drilling methods: laser drilling and mechanical drilling. Laser drilling is suitable for blind holes with small apertures (such as 6MIL), while mechanical drilling is suitable for larger apertures (such as 0.20mm).

3. Plating

After drilling, electroplating is required. For blind hole plating, the treatment of the outer board surface depends on the line width and the thickness of the through-hole board. For example, when the outer line width is greater than 6MIL and the through-hole board thickness is less than 80MIL, the outer board surface can be plated as a whole board; in other cases, a film may be required to protect the board surface.

4. Lamination and processing

Next, the multi-layer circuit board is combined to complete the connection between the inner and outer layers. This includes copper plating, semi-curing, pre-pressing, drilling, plug-in, copper pressing, milling, sheet metal, bare board etching, pre-preg coating, drying and other processes.

5. Surface treatment and testing

Finally, the complete HDI blind and buried hole circuit board is surface treated and tested. Surface treatment may include gold/silver/tin plating on the board surface to enhance the conductivity and corrosion resistance of the board surface; testing includes electrical performance testing, appearance inspection, reliability testing, etc. to ensure that the HDI circuit board can operate normally.

The above is the basic production process flow of HDI blind and buried hole circuit boards. Please note that these steps may vary depending on the specific technology and requirements of different manufacturers.