High thermal conductivity aluminum substrate and thermal conductivity of aluminum substrate
High thermal conductivity aluminum PCB substrate and thermal conductivity of aluminum substrate
The thermal conductivity of aluminum substrate is a heat dissipation performance parameter of aluminum substrate, which is one of the three major criteria for evaluating the quality of aluminum substrate (thermal resistance value and pressure resistance value are the other two properties). The thermal conductivity of aluminum substrates can be measured by measuring instruments after the plates are pressed. Currently, ceramic and copper substrates generally have high thermal conductivity values. However, due to cost considerations, most of the aluminum substrates on the market are currently aluminum substrates, and the corresponding thermal conductivity of aluminum substrates is of greatest concern to large companies. The higher the thermal conductivity, one of the indicators representing better performance. "Aluminum substrate is a unique metal based copper clad substrate with good thermal conductivity, electrical insulation, and mechanical processing properties.".? Generally, it is used in LED design and various electronic products, car lights, indoor and outdoor lighting, fully automated equipment, cameras, and so on. LED heat dissipation design is based on simulation and basic design using fluid dynamics software, which is very necessary for the production of aluminum substrates.? The so-called resistance of fluid flow is due to the viscosity of the fluid and the influence of solid boundaries, resulting in a certain resistance of the fluid during the flow process. This resistance is called flow resistance, which can be divided into two types: along the path resistance and local resistance; "Drag along the path refers to the flow resistance caused by sudden changes in the flow state of a fluid in areas where the boundary changes sharply, such as sudden expansion or contraction of a cross section, bends, and other local locations.".? Generally, the heat sink used for LED aluminum substrate is natural heat dissipation, and the design process of the heat sink is mainly divided into three steps:
1. Design the outline drawing of the radiator according to relevant constraints;?
2. Optimize the tooth thickness, tooth shape, tooth spacing, and thickness of the aluminum substrate according to the relevant design criteria for the aluminum substrate radiator;?
3. Perform check calculations to ensure the heat dissipation performance of the radiator.
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