FPC soft pcb board thickness specifications and process parameters of various materials

FPC soft pcb board thickness specifications and process parameters of various materials

FPC single and double sided flexible limited edition material specification table

Copper foil specifications:

1.1 Half: PI thickness: 0.0254mm (25.4um)

Glue thickness: 0.02mm (20 um)

Copper thickness: 0.018mm (18 um)

2.Half to half: PI thickness: 0.0125mm (12.5um)

Glue thickness: 0.013mm (13 um)

Copper thickness: 0.018mm (18 um)

3. Double panel half to half: Copper thickness: 0.018mm (18 um)

Glue thickness: 0.013mm (13 um)

PI thickness: 0.0125mm (12.5um)

Glue thickness: 0.013mm (13 um)

Copper thickness: 0.018mm (18 um)

4. Double panel 1 pair 1: Copper thickness: 0.036mm (36 um)

Glue thickness: 0.020mm (20 um)

PI thickness: 0.025mm (25um)

Glue thickness: 0.020mm (20 um)

Copper thickness: 0.036mm (36 um) 3M glue specifications:

1. 9471#: AD glue thickness: 0.05mm

2. 9500#: AD glue thickness: 0.15mm

3. 966#: AD glue thickness: 0.05mm

4. 9495#: AD glue thickness: 0.15mm

5.467#: AD glue thickness: 0.05mm

6. 468#: AD glue thickness: 0.13mm

7. 9448#: AD glue thickness: 0.13mm

Solder mask ink color

1. Matte black

2. Sensitive black

3. Matte white

4. Photosensitive white

5. Sensitive green

6. Photosensitive yellow

7. Gray

8. Brown

9. Customer-specified oil color character color

1. Matte black

2. Sensitive black

3. Photosensitive white

4. Customer-specified oil color

Surface treatment

1. Nickel-plated gold (Au:0.05-0.1um ni:2-5um)

2. Chemical Immersion Gold (Au:0.05-0.1um ni:2-5um)

3. Copper plating (8-20 um)

Cover film

1. PI=0.0125MM,AD=0.15MM

2. PI=0.025MM,AD=0.2MM

3. PI=0.05MM, AD=0.02 process capability parameters

1. Number of layers: single-sided, double-sided

2. Substrate: PI, PET

3. Maximum board size: 250*350MM

4. Minimum PTH aperture: ф0.2MM

5. PTH hole error: +/-0.05MM

6. Minimum line width: 0.1MM

7. Minimum line distance: 0.1MM

8. Minimum punching: 0.7MM

9. Exterior processing: die stamping, manual cutting, laser forming

10. Appearance tolerance: die punching +/-0.2MM, manual cutting

+/-0.5MM

11. Solder mask type: laminated (PI/PET), heat curing for printing multiple colors

Ink

12. Solder mask thickness: ink (15-20UM)

13. Reinforcement type: PI, transparent/white PET, FR-4, steel sheet

14. Reinforcement thickness: PI (3mil, 5mil, 7mil, 9mil)

Transparent/white PET (0.2mm)

FR-4 reinforcement (0.15mm, 0.2mm, 0.4mm)

FPC steel sheet reinforcement (0.15mm, 0.2mm, 0.3mm)

15. Total thickness tolerance of FPC products: +/-0.05mm

16. FPC shipping method: single chip, whole board, whole board micro-connection, customer specified