Why do PCB manufacturers use the Immersion gold process?

Why do PCB manufacturers use the Immersion gold process?

PCB manufacturers, in order to solve the above problems of gilded circuit boards, mainly adopt the following characteristics of PCB boards with gold plated plates:

1. Due to the different crystal structures formed by depositing gold and gilding, the deposited gold will appear golden yellow and more yellow than gilding, resulting in better customer satisfaction.

2. Due to the different crystal structures formed by gold deposition and gold plating, gold deposition is easier to weld than gold plating, which will not cause poor welding and cause customer complaints.

3. Because only the pad of the gold plated circuit board has nickel gold, the signal transmission in the skin effect is in the copper layer, which will not affect the signal quality.

4. Due to the denser crystal structure of precipitated gold compared to gold plating, it is less prone to oxidation.

5. Due to the fact that only nickel gold is present on the solder pad of the sunk gold PCB board, it will not produce gold wire causing slight shortening.

6. Due to the fact that only nickel gold is present on the solder pad of the sunk gold PCB board, the bonding between the solder mask and the copper layer on the circuit is more secure.

7. The engineering will not affect the spacing during compensation.

8. Due to the different crystal structures formed by gold deposition and plating, the stress on the gold deposition plate is easier to control, which is more conducive to the processing of products with bonding. At the same time, it is precisely because sinking gold is softer than plating gold, that making gold fingers from sinking gold plates is not wear-resistant.

9. The flatness and shelf life of the gold plated plate are as good as those of the gold plated plate.