Five major differences between HDI circuit boards and multilayer circuit boards

Five major differences between HDI circuit boards and multilayer circuit boards

HDI (high-density interconnect) circuit boards and ordinary multilayer circuit boards are significantly different in many aspects.

Here are their five main differences:

1. Wiring density

HDI circuit boards: HDI technology allows more wiring layers to be arranged on the same area, thereby achieving higher wiring density. This helps to reduce the size of the circuit board while increasing the integration of the product.

Ordinary multilayer circuit boards: In contrast, ordinary multilayer circuit boards have lower wiring density because they are subject to technical limitations and cannot achieve the same wiring density.

2. Line width and spacing

HDI circuit boards: HDI circuit boards allow smaller line widths and spacings, usually up to the micron level. This allows more functional modules to be integrated in a limited space.

Ordinary multilayer circuit boards: Ordinary multilayer circuit boards have larger line widths and spacings and cannot achieve the same line density.

3. Aperture size

HDI circuit boards: HDI circuit boards can use smaller diameter apertures to achieve connections, such as blind vias and buried vias. These apertures do not need to run through the entire circuit board layer, simplifying the wiring and reducing electromagnetic interference and signal loss.

Ordinary multi-layer circuit boards: Ordinary multi-layer circuit boards usually use larger apertures, which may cause higher electromagnetic interference and signal loss.

4. Structural complexity

HDI circuit boards: HDI circuit boards can achieve more complex structural designs, such as stacked and vertical stacked (through vias). This allows the integration of more functional modules in a limited space.

Ordinary multi-layer circuit boards: Ordinary multi-layer circuit boards have a relatively simple structure and usually use fewer layers.

5. Manufacturing process and cost

HDI circuit boards: Since HDI circuit boards have higher wiring density, smaller line width and spacing, and smaller apertures, higher process control requirements are required during the manufacturing process. The production of HDI circuit boards requires more advanced production processes and equipment, such as laser hole forward shifting and laser drilling, which also makes the manufacturing cost of HDI multi-layer circuit boards relatively high.

Ordinary multi-layer circuit boards: The manufacturing process of ordinary multi-layer circuit boards is relatively simple and the cost is low.

In summary, HDI circuit boards have higher wiring density, smaller line width/spacing and aperture, more complex structural design, and higher production process requirements and manufacturing costs compared to ordinary multi-layer circuit boards. These characteristics make HDI multi-layer circuit boards widely used in high-performance electronic devices such as mobile communication devices, smart phones, laptops, and high-speed signal transmission.