How can high-micro-drilled circuit boards engineer achieve a big breakthrough with small apertures?

How can high-micro-drilled circuit boards engineer achieve a big breakthrough with small apertures?

In the process of electronic equipment being continuously miniaturized and high-performance, micro-drilled circuit boards play a pivotal role, especially in the field of high-difficulty PCB manufacturing.

Micro-drilled circuit boards, as the name suggests, refer to circuit boards with tiny apertures drilled on printed circuit boards. The apertures of these micro-holes are usually less than 0.15mm, and can even reach tens of microns.

The manufacture of micro-drilled circuit boards relies on advanced and precise technology. Laser drilling technology is one of the commonly used methods, using a high-energy-density laser beam to instantly ablate tiny holes on an insulating substrate. This technology has extremely high precision and processing speed, can complete drilling operations in a very small space, and has minimal thermal damage to surrounding materials. Chemical etching drilling and other technologies also play a role in some scenarios, corroding the substrate through specific chemical solutions to accurately control the formation of micro-holes.

In high-difficulty PCBs, micro-drilled circuit boards have their advantages. First, it greatly improves the wiring density of the circuit board. Tiny vias make the electrical connections between different layers more compact, and more lines can be arranged on a limited circuit board area, achieving more complex circuit designs and meeting the needs of electronic products for multifunctional integration. Second, micro-drilling can effectively shorten the signal transmission path, reduce signal transmission delay and interference, and improve the stability and speed of signal transmission, which is crucial for high-difficulty PCB application scenarios such as server motherboards with high-speed data transmission and 5G communication equipment.

However, the manufacture of micro-drilled circuit boards faces many challenges. Due to the small aperture, the accuracy, stability of the drilling equipment and the technical level of the operator are extremely high. In subsequent process links such as hole metallization, it is necessary to ensure that the conductive metal is evenly and completely deposited on the inner wall of the microhole to achieve reliable electrical connection, which also tests the fineness of the manufacturing process. But it is through the continuous overcoming of these difficulties that micro-drilled circuit boards promote the continuous progress of high-difficulty PCB manufacturing technology and provide strong support for the innovative development of electronic equipment.