The difference between PCB rolled copper foil and electrolytic copper foil

The difference between PCB rolled copper foil and electrolytic copper foil

1. The production process is different. Electrolysis is completed by electroplating process, and rolled copper is produced by coating.

2. The performance is different. Electrolytic copper has better conductivity, and rolled copper has better flexibility. Generally, rolled copper is used for products with bending requirements. The unit price of rolled copper is more expensive than that of electrolytic copper.

3. Electrolytic copper molecules are relatively loose and easy to break; rolled copper molecules are tight and flexible, and the thinner the better; the phosphorous rolled copper molecules are delicate, and the post-processing electroplating surface is brighter, but the flexibility is worse than pure rolled copper.

4. Electrolytic copper is made by using electric current to separate the copper ions in the copper sulfate solution, and then the process is completed after anti-oxidation and roughening treatments. Calendered copper is made by rolling copper ingots, and then undergoing processes such as forging, anti-oxidation, and roughening treatments. Compared with electrolytic copper, rolled copper production is more difficult. At present, there are only three companies in the world that can mass produce (according to relevant reports). The ductility is better (up to 30% or more, and the best SHTE type of electrolytic copper is only 15%. %-20%), mainly used in FPCs, notebook computers, tablet computers, printers and other places that need to be shielded.