Advantages of HDI mobile phone pcb circuit board

Advantages of HDI mobile phone circuit board

HDI is the abbreviation of High Density Interconnector. It is a kind of (technology) for the production of printed boards. It is a circuit board with a relatively high line distribution density using micro-blind and buried via technology. HDI is a compact product designed for small-capacity users. It adopts modular design that can be connected in parallel. One module has a capacity of 1000VA (1U height) and is naturally cooled. It can be directly placed in a 19” rack, and a maximum of 6 modules can be connected in parallel. The product adopts full digital signal process control (DSP) technology and multiple This patented technology has a full range of load capacity and strong short-term overload capacity, regardless of load power factor and crest factor.

HDI is the abbreviation of High Density Interconnector. It is a kind of (technology) for the production of printed boards. It is a circuit board with a relatively high line distribution density using micro-blind and buried via technology. HDI is a compact product designed for small-capacity users. It adopts modular design that can be connected in parallel. One module has a capacity of 1000VA (1U height) and is naturally cooled. It can be directly placed in a 19” rack, and a maximum of 6 modules can be connected in parallel. The product adopts full digital signal process control (DSP) technology and multiple This patented technology has a full range of load capacity and strong short-term overload capacity, regardless of load power factor and crest factor.

While electronic design continues to improve the performance of the whole machine, it is also working hard to reduce its size. In small portable products ranging from mobile phones to smart weapons, "small" is an eternal pursuit. High-density integration (HDI) technology can make terminal product designs more compact, while meeting higher standards of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camcorder) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by the build-up method. The more build-up times, the higher the technical grade of the board. Ordinary HDI boards are basically one-time build-up. High-end HDI uses two-time or more build-up technology. At the same time, advanced PCB technologies such as stacking holes, electroplating hole filling, and laser direct drilling are used. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.

Development prospects: according to the use of high-end HDI boards-3G boards or IC carrier boards, its future growth is very rapid: the world's 3G mobile phones will grow by more than 30% in the next few years, and China will issue 3G licenses; IC carrier board industry consultation The organization Prismark predicts that China's predicted growth rate from 2005 to 2010 is 80%, which represents the direction of PCB technology development.

HDI circuit advantages

   It can reduce the cost of PCB: When the density of PCB increases to more than eight-layer board, it is manufactured with HDI, and its cost will be lower than that of the traditional and complex pressing process.

    Increase circuit density: the interconnection of traditional circuit boards and parts

    Conducive to the use of advanced construction technology

    Have better electrical performance and signal accuracy

    Better reliability

    Can improve thermal properties

    Can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD)

    Increase design efficiency