How HDI PCB Technology Drives Electronics Success

How HDI PCB Technology Drives Electronics Success

Some Benefits of HDI PCB Features

The reason why electronic devices are getting smaller and smaller is due to the use of certain processes and technologies. These technology solutions make it easier for designers to create PCBs to help speed product manufacturing and meet customer requirements.

Pad-in-Through-Hole Process Improves PCB Production Efficiency: This process is inspired by SMT technology. The through-hole pad process allows through-holes to be placed within the flat pads of the circuit board. The through holes can be plated or filled with epoxy and then capped. These two steps not only make the vias invisible, but also eliminate eight steps of the HDI PCB production process. Therefore, the via fill process is always used to create PCBs with Ball Grid Array (BGA), Chip on Board (COB) and Chip Scale Package (CSP).

Cost-effective design: Despite the smaller manufacturing dimensions of electronic products, customers still expect high-quality performance from their products. When HDI technology is used in PCB design, it enables designers to reduce the size of the PCB from 8 layers to 4 layers. Likewise, the routing of a 4-layer PCB can be designed the same as an 8-layer Flex PCB. Reducing the number of layers also leads to a reduction in the use of manufacturing materials. These aspects affect the overall price of an electronic product, making it a value-for-money product for customers.

Multiple Via Process Improves Performance: Since most PCBs used in electronics are double-sided and multi-layered, multiple through-hole processes are used in the PCB manufacturing process. The use of blind via or via pad technology enables designers to place smaller size components more closely on the board. This results in smaller PCB pitch and I/O geometry. As a result, the PCB is able to transmit signals faster without suffering crossover delays or signal loss.