Brief introduction of rigid PCB sheet 94VO

Brief introduction of rigid PCB sheet 94VO

We often see words like 94-VO on it, which are added by the circuit board factory. If the LAYOUT board is distinguished by flame retardant properties, it can basically be divided into two types of substrates: flame retardant (UL94-VO, UL94-V1) and non-flame retardant (UL94-HB). With the rapid development of electronic product technology, higher performance for cCL

We often see words like 94-VO on it, which are added by the circuit board factory. If the LAYOUT board is distinguished by flame retardant properties, it can basically be divided into two types of substrates: flame retardant (UL94-VO, UL94-V1) and non-flame retardant (UL94-HB). With the rapid development of electronic product technology, cCL has higher performance requirements. In recent years, with more emphasis on environmental protection issues, a new type of bromine-free CCL has been classified in flame-retardant CCL, which can be called "green flame-retardant CCL". The design is classified from the performance of CCL, and is divided into general performance CCL, low dielectric constant CCL, high heat resistance CCL (generally L is above 150 ° C), and low thermal expansion coefficient CCL (usually used on package substrates) And other types.

As the functions of electronic products are becoming more and more complex, the requirements of frequency and performance are becoming higher and higher. In order to meet the above requirements, and also take into account the product shape, almost all of them are moving towards multilayer boards. Therefore, copper based on fiberglass cloth Foil substrates are currently mainstream in the market.

According to the reinforcing materials of the board, it can be divided into five categories: paper base, glass fiber cloth base, composite base (CEM series), laminated multi-layer board base and special material base (ceramic, metal core base, etc.). According to the resin adhesive used in the substrate, it is classified. Common paper-based (with insulating paper as a reinforcing material) CCI includes phenolic resins (XPc, XxxPC, FR-1, FR-2, etc.), epoxy resins ( FE-3), polyester resin and other types. In terms of glass fiber cloth, the most widely used are epoxy resins (FR-4, FR-5), and there are other special resins (glass fiber cloth, polyamide fiber, non-woven cloth, etc. as additional materials) ) Substrate types, these special resins include: resin (BT), imine resin (PI), diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanide Ester resin, polyolefin resin, etc.

In manufacturing, the materials are basically composed of copper foil substrate (CCL), copper foil, film and various chemical products. In terms of the cost of raw materials, the cost of copper foil substrate is the highest, and with the number of layers The difference is from about 50% to 70%. The main components of the copper foil substrate are glass fiber cloth and electrolytic copper foil. The function of glass fiber cloth is to strengthen the hardness. Its material is made of glass fiber yarn by plain weaving. Electrolytic copper foil is one of the basic materials for the electronics industry. Because its copper foil substrate is an indispensable material, its quality requirements are quite high. It not only requires heat resistance and oxidation resistance, but also requires no pinholes on the surface. , Wrinkles, and laminates must have higher peel strength, and must be able to form printed circuits using general etching methods, and do not deal with substrate contamination such as particle migration, which is a high-level copper processing material.