PTFE ceramic composite dielectric substrate TFA series of pr oducts of the dielec tric layer c omposition of PTFE resin and c eramic, do no t use the glass fiber clo th dipping me thod to make prefabricated sheet, but the use of ne w technology to make prefabricated sheet, and then pr essed by a special pr essing process. With the same le vel of dielec tric constant excellent electrical properties, thermal pr operties, mechanical properties, is aer ospace grade high fr equency high r eliability materials, can replace similar f oreign products. This series of subs trate does no t contain glass fiber clo th, using a lar ge number of unif orm special nano -ceramics and r esin mixture, electromagnetic wave propagation without glass fiber eff ect, excellent frequency stability, dielectric loss of the same le vel of the lowes t, the ma terial X / Y / Z the lowes t anisotropy, the material at the same time has the same as the c opper foil low thermal e xpansion coefficient, stable dielectric temperature characteristics. The dielectric constant of this series is 2.94, 3.0, 6.15, 10.2. The TFA series c omes standard with R TF low r oughness copper foil, which r educes conductor loss while providing excellent peel s trength. TFA294 and TF A300 can be ma tched with buried 50Ω r esistive copper foil to form resistive film shee ts. The circuit board can be pr ocessed by s tandard PTFE sheet technology. The e xcellent mechanical and physical properties of the shee t make it suit able for multilayer, high multilayer and b ackplane processing; at the same time, it shows e xcellent processability in the pr ocessing of dense holes and fine lines. ◈ Small dielec tric constant tolerance and e xcellent batch-to-batch consistency; ◈ Lowest dielectric loss in it s class; ◈ Use of fr equencies up t o 77G f or millimeter wave and aut omotive radar applications; ◈ Excellent frequency stability and phase s tability from -55°C t o 150°C; ◈ Excellent irradiation resistance, maintaining stable dielectric and physic al properties after dose irr adiation treatment; ◈ Low outgassing performance, tested according to the s tandard method of ma terial volatility performance under vacuum conditions, meeting the r equirements of v acuum outgassing for aerospace applications; ◈ Excellent thermal e xpansion coefficient, equal t o copper foil; ensures the r eliability and dimensional thermal stability of c opper hole; ◈ Low water absorption, ensuring the s tability of the ma terial under humid envir onment.
Typical Applications
◈ Aerospace equipment , space, in-cabin equipment , aircraft ◈ Microwave, antenna, phase -sensitive antenna ◈ Early w arning radar, airborne r adar and o ther kinds of r adar ◈ Phased arr ay antennas, beamwave networks ◈ Satellite communication, navigation ◈ Power amplifier
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