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ShengYi SI10US

Advanced High Modulus Material for PKG Substrate

Features
Tg>=270℃（DMA），Td>400℃（5% loss ,TGA）
High Flexural Modulus
Low X/Y/Z-axis CTE
Halogen-free,compatible with lead-free processing

Applications
eMMC,DRAM
AP,PA
Dual CM
Fingerprint modules,RF Modules,Etc.

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