PCB Assembly

Electronics Prototype PCB Assembly Service Manufacturer in China

4 Layer PCB assembly
Prototype PCB Assembly
Electronics Prototype PCB
fr4 pcb assembly
Product description: Prototype PCB Assembly PCB prototyping has always been one of our most requested services, whether it’s PCB prototype fabrication or assembly. Our expert engineers will check and test your layout to
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Quick detail:

Layer:4

Board material:Fr4

Surface finish:HASL lead free

Copper weight:1OZ

Board thickness:1.6mm

PCB assembly:yes

Solder mask:Green

Silkscreen:White

Product name:4 Layer PCB assembly prototype

Prototype PCB Assembly

PCB prototyping has always been one of our most requested services, whether it’s PCB prototype fabrication or assembly. Our expert engineers will check and test your layout to ensure the correct prototype is fabricated and assembled on the first

assembly run. Through our network of PCB component suppliers and SMT assembly engineers, we can ensure you a quick turn around and top quality circuit board. We offer low volume circuit assembly for prototyping with DFM and DFT to eliminate possible issues in your product.

Board and System Board Level Testing:

AOI Testing	X-Ray Inspection	In Circuit Testing
solder paste	Micro BGAs	Power-up Test
components down to 0201"	Chip scale packages	Advanced Function Test
components, offset, incorrect parts	Bare boards	Flash Device Programming

Electronics Prototype PCB Assembly Service

EMS-Electronic Manufacturing Service

PCB Supply and Layout

PCB Assembly on SMT, BGA and DIP

Cost Effective Components Sourcing

Fast Turn Prototype and Mass Production

Box Build Assembly

Engineering Support

Tests(X-ray, 3D Paste Thickness, ICT, AOI and Functional tests)

Logistics and After-sales Service

Product Pestcription

PCBA Layers	1 Layers to 12 layer (standard)
Material	FR4, Aluminum, CEM1
Solder mask	green, black, white, red, blue
Copper thickness	0.5um-4um
Surface finish	HASL,ENIG,OSP
Min holes	0.2mm by machine; 0.1mm by Laser Drilling
Min track width	3mil
PCB Dimension	600x1200mm
IC Pitch(min)	0.2mm
Chip Size(min)	0201
BGA Size	8x6mm~55x55mm
SMT Efficiency	SOP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
U-BGA ball dia.	0.2mm
Required Docs for PCBA	Gerber file with BOM list & Pick-N-Place File(XYRS)
SMT speed	CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs