Sensor IC Substrate
Product Name: LGA IC Substrate PCB
Material: Mitsubishi Gas halogen free BT HL832-NXA
Minimum line width / line spacing: 120 / 25um
Surface technology: ENEPIG
Plate thickness: 0.25mm
Purpose: BGA IC packaging substrate
Contact: Ms Tracy
Phone: 0086 18682010757
Tel: 0086 18682010757
Add: BludingA,Shixiaganglian Industrial Park,Shajing,Baoan,Shenzhen,China