HDI IC substrate
Material: Mitsubishi Gas halogen free BT hl832nx-a-hs
Minimum line width / line spacing: 30 / 30um
Surface finish: nickel palladium (ENEPIG)
PCB thickness: 0.3mm
Number of layers: 4
Aperture: laser hole 0.075mm, mechanical hole 0.1mm
Application: BGA IC substrat
Contact: Ms Tracy
Phone: 0086 18682010757
Tel: 0086 18682010757
Add: BludingA,Shixiaganglian Industrial Park,Shajing,Baoan,Shenzhen,China