Five common problems of drilling holes on printed circuit boards

Five common problems of drilling holes on printed circuit boards

Most of the PCB substrates used for PCB fabrication are copper-clad laminates. With the increasingly mature process capability, the maximum number of layers in some precision factories is as high as 56. However, whether it is single-sided or double-sided board or multi-layer board, it needs to be completed step by step. The first process of PCB fabrication is drilling. Before PCB drilling, first input the data into the computer, and then cut the PCB substrate according to different thickness plates, Determine the number of holes drilled each time, and add a layer of cover plate above the base material, in order to protect the PCB surface from being scratched during the drilling process, reduce burrs, and prevent the hole from slipping on the copper surface, so as to improve the hole position accuracy. After a series of operations, what are the common problems in pcb drilling!

1. Pi Feng: This is the so-called burr. Most of the reasons for this are that when the drill nozzle comes out after drilling, the equipment will vibrate and the impurities around the hole will fall into the hole.

2. Missing drilling: for example, where the drilling is also required at point A, this point is not drilled because the operator is not careful enough or for other reasons.

3. Hole diameter: the number of turns used by the drill nozzle is too many, which makes the drill nozzle become shield, which leads to the inability to drill through the base material at one time, and the hole diameter is easy to occur when drilling the same position repeatedly.

4. Hole deviation: when driving pins, remember to align the four corners, stick the aluminum sheet stably, and cut the size of pins for positioning holes easily. 5. Plug hole: After the PCB board is drilled, it is best to use the air gun to blow at the hole diameter to prevent dust from falling into the hole accidentally, which will lead to the occurrence of no copper in the hole during the subsequent copper plating.