The definition and description of each layer of PCB multi -layer board

The definition and description of each layer of PCB multi -layer board:

1. Top layer (top layer layer): Designed as top copper foil wiring. There is no layer for a single panel.

2. Bomttom Layer (underlying wiring layer): Designed as the bottom copper foil wiring.

3. TOP/BOTTOM Solder (top/bottom layer welding green oil layer): The top/bottom layer is laying welding green oil to prevent copper foil from tin tin and maintain insulation. Welded green oil windows at the pad, perforated and this layer of non -electrical wiring.

In the design, the window will be opened by default (Override: 0.1016mm), that is, the pads of copper foil, expand 0.1016mm, and will be tin when welding. It is recommended not to make design changes to ensure weldability;

In the design, the window will be opened in the design default (Override: 0.1016mm), that is, the perforated copper foil, expand 0.1016mm, and will be tin when welded. If the design is designed to prevent over -the -hole tin, do not show copper, you must check the penting options in the perforated additional attribute Solder Mask (welded window), and turn off the hole opening window.

In addition, the non -electrical wiring can also be carried out separately in this layer, and the welding green oil can be opened accordingly. If it is above the copper foil line, it is used to enhance the current capacity of the wiring and add tin treatment when welding; if it is on the non -copper foil line, it is generally designed to use it as a logo and a special character silk print, which can save the production of production. Character silk seal layer. 4. TOP/BOTTOM PASTE (top/bottom tinnite layer): This layer is generally used in the SMT return welding process of patch components, which has nothing to do with the printed board manufacturer making. Keep the multi -layer board design by default.

5. TOP/BOTTOM Overlay (top/bottom wire printing layer): Designed as a variety of silk marks, such as component bits, characters, trademarks, etc.

6. MeChanical Layers: Designed as PCB multi -layer mechanical shape, default layer1 is the shape layer. Other layer2/3/4 and other can be used as mechanical size marking or special purposes. For example, when some boards need to make conductive carbon oil, we can use layer2/3/4, but the purpose of the layer must be clearly identified on the same layer.

7. Keepout layer (prohibited wiring layer): Designed as a prohibited wiring layer, many designers also use PCB multi -layer board mechanical shapes. If there are Keepout and MeChanical Layer1 on the PCB multi -layer board, it mainly depends on the appearance of these two layers. The degree of integrity is generally subject to Mechanical Layer1. It is recommended to use Mechanical Layer1 as the shape layer when designing. If you use Keepout Layer as the shape, do not use Mechanical Layer1 to avoid confusion!

8. MidLayers (intermediate signal layer): Most for multi -layer boards, our design is rarely used. It can also be used as a special purpose layer, but the purpose of the layer must be clearly identified on the same layer.

9. Internal Planes: For multi -layer boards, our design is not used.

10. Multi Layer: Pass pad layer.

11. DRILL Guide (drilling positioning layer): The central positioning coordinate layer of pad and perforated drilling.

12. DRILL DRAWING (drilling description layer): The dimensions of the diamond pores of the pad and perforated drilling pores.

In Design --PTION:

(Signal layer), Internet

(Internal power/ground floor), Mechanical

Layers (mechanical layer),

Masks (welding layer),

Silk Screen (silk layer),

Others (other working levels)

And system (system working layer),

Perform the menu command [design] design/[option ...] option when the PCB multi -layer board design can set the visibility of each working layer.

1. Signal layers (signal layer)

Protel98, Protel99 provides 16 signal layers: TOP (top layer), BOTTOM (bottom), and MID1-MID14 (14 middle layers).

The signal layer is the wiring layer used to complete the copper foil of the circuit board. When designing double panels, only TOP (top) and bottom (bottom layer) are generally used.

When the number of printing circuit boards exceeds 4 layers, the MID (intermediate wiring layer) needs to be used.

2. Internal Planes (internal power/ground layer)

Protel98, Protel99 provides Plane1-Plane4 (4 internal power/ground floor). The internal power/ground layer is mainly used for printed circuit boards above 4 layers as power supply and ground -dedicated wiring layer, and double panels do not need to be used.

3. Mechanical layers (mechanical layer)

The mechanical layer is generally used to draw the frame (boundary) of the printed circuit board, and usually only one mechanical layer is needed. There is Mech1-MECH4 (4 mechanical layers).

Fourth, DRKll Layers (drilling position layer)

There are 2 layers: "Drill Drawing" and "Drill Guide". Used to draw the positioning of drilling holes and holes.

5. Solder Mask (welding layer)

There are 2 layers: TOP (top layer) and BOTTOM (bottom layer). The pads on the circuit board are drawn on the welding layer and the protection areas around the circuit board.

6. Paste Mask

There are 2 layers: TOP (top layer) and BOTTOM (bottom layer). The protective layer of the tiny paste is mainly used for the printing circuit board with surface stickers device. At this time, the installation process of the table post component is required. There is no need to use this layer when there is no tablet component.

Seven, Silkscreen (silk layer)

There are 2 layers: TOP (top layer) and BOTTOM (bottom layer). The wire printing layer is mainly used to draw text descriptions and graphic descriptions, such as the outline, labeling and parameters of the components.

8. Other (other layers)

There are 8 floors: "Keep Out (prohibited wiring layer)", "Multi Layer (set multi -level)", "Connect (connected layer)", "DRC Error", 2 "Visible Grid "Layer)" Pad HOLES (pad pad layer) "and" Via Holes (over -hole layer) ". Some of these layers are used by the system as Visible Grid (visual grid layer) to facilitate positioning when drawing. The Keep PUT is used during automatic wiring, and the handmade wiring does not need to be used.

For hand -drawn double -sided printed circuit boards, the most used are TOP LAYERS (top -level copper foil wiring), Bottom Layers (bottom -layer copper foil wiring) and Top Silkscreen (top wire quotes). Each layer can choose a color that is accustomed to. Generally, the top layer is green or white, the bottom layer is green or white, pads and pores with yellow.