The use of vias by circuit board manufacturers

The use of vias by circuit board manufacturers

In the design of high-speed PCB boards by circuit board manufacturers, seemingly simple vias often bring great negative effects to the circuit design. In order to reduce the adverse effects caused by the parasitic effects of the vias, the following can be done in the design:

1. Considering both cost and signal quality, select a reasonable size via size. If necessary, you can consider using different sizes of vias. For example, for power or ground vias, you can consider using a larger size to reduce impedance, and for signal traces, you can use smaller vias. Of course, as the size of the via decreases, the corresponding cost will increase.

2. The two formulas discussed above can be concluded that the use of a thinner PCB is beneficial to reduce the two parasitic parameters of the via.

    3. Try not to change the layers of the signal traces on the PCB board, that is, try not to use unnecessary vias.

4. The power and ground pins should be drilled nearby, and the lead between the via and the pin should be as short as possible. Consider drilling multiple vias in parallel to reduce the equivalent inductance.

5. Place some grounded vias near the vias of the signal layer changeover to provide the nearest loop for the signal. You can even place some redundant ground vias on the PCB.

6. For high-speed PCB boards with higher density, you can consider using micro vias.