Which aspects of FPC board still need innovation in the future?

Which aspects of FPC board still need innovation in the future?

FPC (Flexible Circuit Board) is a type of PCB, also known as a "flexible pcb board". FPC is made of flexible substrates such as polyimide or polyester film. It has the advantages of high wiring density, light weight, thin thickness, bendability, and high sensitivity. It can accept millions of times of dynamic bending without damaging the wires. It can move and expand freely according to the requirements of spatial layout, complete three-dimensional assembly, and achieve the integration of component equipment and wire connection. It has the advantages that other types of circuit boards cannot compare. So, which aspects of FPC still need innovation in the future? Let's take a brief look:

1. Thickness. The thickness of FPC will definitely become more sensitive and thinner;

2. Folding resistance. Bending is an inherent characteristic of FPC, and in the future, FPC will have stronger bending resistance, exceeding 10000 times. Of course, this requires a better substrate;

3. Value. At present, the value of FPC is much higher than that of PCB. If the value of FPC decreases, the market will definitely be much broader.

4. Process level. In order to meet various requirements, the FPC process must be upgraded, and the small aperture and small line width/line spacing must meet higher requirements.

The above are several methods that FPC needs to innovate in the future, hoping to be helpful to you.