The main trend of PCB development in 2022

The main trend of PCB development in 2022

With the huge impact of the latest technologies such as 5G, the Internet of Things and artificial intelligence on the electronics world, the PCB manufacturing industry has developed a lot now. The new trend during the development of PCB is catching up quickly. The global PCB market is expected to be about 75 billion US dollars in 2023.

All areas related to PCB are developing at the same time, including: direct imaging, where the circuit pattern is directly printed on the material; new materials for substrates; new methods of surface smoothness testing; flexible PCB; the degree of automation of the manufacturing process; and more environmentally friendly.

The root cause of these technological trends is the growth of the market's demand for PCB.

The communication speed develops rapidly with the 5G technology network. IoT technology has created specific IoT devices for almost every industry, including industrial automation, smart home, medical care and wearable equipment. Artificial intelligence and machine learning have penetrated into areas outside the manufacturing or assembly workshop.

Wearable devices, such as glasses, chip implants or prosthesis. Autonomous driving technology is used to achieve different levels of functions or action automation, including drones and drones.

PCB development trend listed in the global circuit board market

There are different needs for different technologies of PCB, such as changing the shape of PCB or related accessories. Recently, the camera module has made significant progress to improve high -resolution pictures and video imaging. The car camera will become a strong demand in the field of consumer electronics and industrial fields.

3D printing electron (3D PE) is changing the design of the electrical system. 3D PE is an additive manufacturing process that can build a 3D circuit by printing layers. 3D printing can quickly make prototypes in a short period of time. No minimum construction volume is required. Use this printing technology without any boarding process. Due to automation, this will expand product functions and improve overall efficiency.

Compared with traditional PCB, high -density interconnection (HDI) PCB provides high -performance and extremely thin materials. This provides compact wiring, tiny laser holes and pads. HDI PCB is the first choice for miniaturized electronic products.

With the increase of mobile phones and Internet TV subscriptions, consumer electronics is one of the fastest growing trends. Wearable devices such as smart watches have also contributed to the expansion of the consumer field. These applications are increasing the demand for compact, accurate and multifunctional PCB. In addition, due to the durability and size advantages they provided, the latest IoT applications are promoting the development of flexibility and rigidity.

The large number of chips in the semiconductor industry forced PCB experts to study new alternatives. The non -degradable electronic waste also seriously affected the environment, causing designers to explore PCBs with organic or biodegradable PCB as alternatives.

Solutions that support artificial intelligence are now at the forefront of almost all industrial fields. The application of artificial intelligence is creating a demand for the improvement of PCB design and manufacturing processes. Focusing on accelerating the development cycle to reduce defects and quickly deliver products is the key goal of maintaining the PCB industry.

Traditionally, PCB is a passive media for connecting the active component of the circuit design. But recently, designers have been exploring the possibility of making PCB itself a source of circuits. This method can reduce the requirements of the component and perform the required functions at the same time.

Technical trends such as augmented reality (AR) and virtual reality (VR) are leading the field of consumer electronics, and affecting PCB design to solve problems such as installing electronic packaging in unconventional shapes. This will confirm the correct circuit operation and reduce layout and wiring technical requirements. In addition, AR with software simulation methods can reduce the cost of training procedures, because advanced simulation can copy the actual environment of magnetic fields and electric fields. This will confirm that the product meets the required regulations.

The demand for electric vehicles and autonomous vehicles has grown rapidly, and the requirements for PCB with good heat dissipation capabilities are getting higher and higher. Advanced car PCB design will solve security, convenience and environmental problems. New energy such as electrical electronics will require PCB with excellent heat design. During the PCB design period, high -current requirements and thermal issues should be treated. It is mandatory to choose to enhance PCB wiring and follow effective layout strategies.

Multi -layer PCB manufactured complex design requirements cover all applications. PCB in medical and aerospace applications require strict control of EMI issues. In addition, mobile phone developers need to minimize unnecessary radiation hazards. If the PCB design does not comply with EMI regulations, a large number of circuit boards may eventually be redesigned, thereby increasing costs and delaying final delivery. The increasing popularity of flexible PCB has also brought new challenges to PCB designers. The possibility of electromagnetic interference between elements and wiring in flexible PCB is very high, resulting in a decline in performance. This problem contributed to the demand for the built -in ESD protection system.

With the development of trends, the speed of PCB design and development has been greatly improved. However, it can reduce errors and debugging costs by spending more time to design, manufacture and assemble products.

With the development trend of PCB, with the latest technological innovation, PCB manufacturers will have to establish a more dynamic supply chain and flexible manufacturing process to meet the requirements of these PCB trends.