The development history of PCB and the development process of PCB in China

The development history of PCB and the development process of PCB in China

PCB English is called Printed Circuit Board, Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, printed circuit board. The prototype of the PCB comes from the telephone switch system that used the concept of "Circuit" in the early 20th century. It was cut into a line conductor with metal foil and glued to the middle of two paraffin papers. The true PCB was born in the 1930s. It is made by electronic printing. It is made of an insulating board and cut into a certain size. It has at least one conductive pattern attached to it and is covered with holes (such as component holes and tights). Solid-holes, metallized holes, etc., are used to replace the chassis of electronic components of conventional devices, and to realize interconnection between electronic components, and to function as relays, which are supports for electronic components, and have "electronic products." The mother of the name.

World PCB development history

In 1936, the founder of printed circuit boards, Austrian Paul Eisler, first used printed circuit boards in radio installations.

In 1943, Americans used the technology in military radios.

In 1947, the US Aviation Administration and the US Bureau of Standards launched the first technical seminar on PCBs.

In 1948, the United States officially recognized the invention and used it for commercial purposes.

In the early 1950s, due to the problem of the bond strength and solder resistance of CCL's copper foil and laminate, the performance was stable and reliable, and industrialized production was realized. Copper foil etching became the mainstream of PCB manufacturing technology, and production orders began. panel.

In the 1960s, the realization of large-scale production of hole metallized double-sided PCBs.

In the 1970s, multi-layer PCBs developed rapidly and continued to develop in the direction of high precision, high density, fine line small holes, high reliability, low cost and automated continuous production.

In the 1980s, surface mount printed boards (SMT) gradually replaced plug-in PCBs and became the mainstream of production.

Surface mounts have evolved from flat package (QFP) to ball-on array package (BGA) since the 1990s.

Since the beginning of the 21st century, high-density BGA, chip-scale packaging, and organic laminate materials have been rapidly developed for multi-chip module package printed boards.

China PCB development history

In 1956, China began PCB development work.

In the 1960s, mass production of single-panel, small-volume production of double-sided schools and the beginning of the development of multi-layer boards.

In the 1970s, due to the limitations of historical conditions at that time, the development of printed board technology was slow, making the entire production technology lag behind the advanced level of foreign countries.

In the 1980s, advanced level single-sided, double-sided, multi-layer printed board production lines were introduced from abroad, which improved the production technology level of printed boards in China.

In the 1990s, foreign printed board manufacturers in Hong Kong and Taiwan, as well as Japan, came to China to establish joint ventures and wholly-owned factories, which made China's printed board production and technology advance by leaps and bounds.

In 2002, it became the third largest PCB producer.

In 2003, PCB output value and import and export volume exceeded US$6 billion, surpassing the United States for the first time, becoming the world's second largest PCB producer. The proportion of output value also increased from 8.54% in 2000 to 15.30%, nearly doubled.

In 2006, China has replaced Japan as the world's largest PCB production base and the most active technology development country.

In recent years, China's PCB industry has maintained a high growth rate of around 20%, far higher than the growth rate of the global PCB industry. From 2008 to 2016, the output value of China's PCB industry increased from US$15.037 billion to US$27.123 billion, with a compound annual growth rate of 7.65%, much higher than the global composite growth rate of 1.47%. In 2018, China's PCB output value reached US$33.6 billion, an increase of 10.16% year-on-year.