Analyze the optimization method of PCB design with too dense solder joints

Analyze the optimization method of PCB design with too dense solder joints

PCB design solder joints are too dense, which may cause continuous wave soldering and electric leakage between solder joints. The following editor will analyze the optimization method of PCB design with too dense solder joints for everyone.

Analysis: This board has more plug-in components and is relatively dense. Because the distance between the solder joints and the solder joints is close to 0.3-0.5mm, it is easy to cause continuous welding. At the same time, because of the poor quality of the flux, it causes a large amount of electric leakage in the rainy weather in the south.

     Countermeasure: Increase the distance between solder joints and add solder mask oil in the middle. Strictly control the quality of flux.

     Thinking: When designing a denser PCB board, try to be as small as possible, and open the place that can be opened as much as possible. For example, although the safety distance of the PCB is 0.3MM, the area where it can be 0.6MM should be increased to more than 0.6 as much as possible, so that the probability of problems will be greatly reduced.