IC substrate PCB board

IC substrate PCB board

IC package carrier board is a key special basic material. There are several types of 6PIN, 8PIN, dual interface and non-contact packaging frame.

Introduction

The IC card packaging frame refers to a key special basic material used for the packaging of integrated circuit card modules. It mainly protects the chip and acts as an interface between the integrated circuit chip and the outside world. It is in the form of a strip, usually golden yellow. The specific use process is as follows: first, the integrated circuit card chip is pasted on the IC card packaging frame by the automatic placement machine, and then the contacts on the integrated circuit chip and the nodes on the IC card packaging frame are connected by a wire bonding machine. The circuit is connected, and finally the integrated circuit chip is protected by the packaging material to form an integrated circuit card module, which is convenient for subsequent applications. The supply of IC card encapsulation frame is all imported.

type

According to the use and form of the IC card packaging frame, it can be divided into 6PIN, 8PIN, dual interface and non-contact packaging frames, all of which are manufactured in strict accordance with the standards of the International Standards Organization (ISO) and the International Electrotechnical Commission (IEC). , in order to facilitate the automation of subsequent production and processing. However, the surface pattern of the IC card package frame can be customized according to specific requirements.

According to the material of the IC card packaging frame, it can be divided into two types: metal IC card packaging frame and epoxy IC card packaging frame. The metal IC card packaging frame is mainly used for the packaging of the non-contact integrated circuit card module, while the packaging of the contact integrated circuit card module mainly adopts the IC card packaging frame of the epoxy base material.

Manufacturing process

The manufacturing process of IC card packaging frame is a high-precision and complex process. Shandong Henghui Electronics produces it in China, which fills the domestic gap. The basic materials used in the production process are mainly imported. The specific production and processing process is as follows: First, the high-speed precision punch is used to punch out the corresponding vacancies on the glass fiber substrate according to the design requirements, and then the conductive materials are bonded together by the precision film equipment, and the designed pattern is exposed by photographic technology. On its surface, the finished product is finally formed through corresponding post-processing procedures.