Circuit board orders are full! PCB manufacturers focus on investing in high-end HDI circuit boards

Circuit board orders are full! PCB manufacturers focus on investing in high-end HDI circuit boards

In 2019, the time passes particularly fast. Under the uncertainty of the US-China trade war, PCB factories including Dingying, Jianding, Xinxing, etc. have rewritten their new revenues in August. The most important reason is that high-end HDI boards receive orders and output The overfilling of goods is also an important reason for the US-China trade war to push customers to pull goods ahead of schedule. ONESEINE TECHNOLOGY orders are also booming. At any time, 5G development and market trends, ONESEINE TECHNOLOGY In order to better meet current customers and share a fruit in the fiercely competitive market, this year is also mass production orders and high Development of sophisticated and difficult orders.

The PCB circuit board industry emphasizes that the current electronics-related products and PCB board design are mainly based on HDI Anylayer process planning, and even the mainstream of automotive board design trends; high-density connection board (HDI) to the development of any layer (HDI Anylayer) process In the past two years, the application has spread significantly; and large PCB factories have sufficient funds and technology to expand production capacity and take orders, resulting in the concentration of orders to large factories.

   In addition, the situation of the US-China trade confrontation has not changed. Customers concentrated on placing orders and pulling goods in advance to avoid risks, pushing Huatong to receive a large number of high-end HDI mobile phone orders in the second quarter, to get rid of quarterly revenue and five quarters of annual decline.

   Looking back at the history of HDI Anylayer board production, this type of product was developed by a PCB factory in the past. It was first adopted by Apple in 2010 to launch the iPhone 4. It is the same as the current situation of carrier boards. The initial production and market size are not large, but after 2 years, The market introduction situation is gradually popularized, and the development has become a mature process today.

    Since the beginning of this year, the expansion of PCB factories has been due to the unresolved trade conflict between the United States and China, the tightening of China ’s environmental protection regulations, and the unpredictable global economic outlook. Industry investment is still strong.

In terms of industrial competition, in addition to technological innovations such as HDI (High Density Connection Board), HDI Anylayer, rigid and flexible boards, carrier-like boards, etc., in response to the client's design trends for 3C electronics being light, thin, short and small To the development of new product application fields such as semiconductor COF, the use of high technical barriers to widen the gap with competitors; even if competitors intend to cross the threshold of high-tech competition, they must first solve the huge capital needs for technical upgrades.