F-PCB Application

F-PCB Application

F-PCB will use epoxy glue for conductive connection, structural bonding, stress relief, and potting and protection, such as integrated circuit IC top seal. There are many reasons to choose Epotek's glue, for example, its curing temperature will be lower than the melting temperature (Tm) of the thermoplastic material used in F-PCB; due to the temperature and stress of the solder paste, the use of glue Replacement; and some other occasions that require flexible glue. These applications include things like smart cards, RFID, LCD conductive connections, OLEDs, solar cells, keyboard membranes, medical devices, and inkjet printers.