10 Layer FR4 IT180A PCB Board | 1.8mm ENIG Finished & Controlled Impedance Stackup

10 Layer FR4 IT180A PCB Board | 1.8mm ENIG Finished & Controlled Impedance Stackup

 

10-layer FR4 IT180A PCB is a high-reliability multilayer printed circuit board with standard 1.8mm finished thickness and precise controlled impedance design. Adopting high Tg IT180A FR4 substrate and ENIG surface finish, this 10-layer PCB provides excellent thermal stability, low warpage performance and stable signal integrity, widely used in industrial control, communication equipment, automotive electronics and high-precision instrument systems.

Basic PCB Specifications

- PCB Material: FR4 IT180A (High Tg, high reliability substrate)

- Layer Count: 10 Layers

- Finished Board Thickness: 1.8mm ± 0.18mm

- Surface Finish: ENIG (Electroless Nickel Immersion Gold)

10 Layer PCB Detailed Stackup Structure

This controlled impedance 10-layer PCB adopts symmetrical stackup design with alternating core and prepreg (106 / 1080) materials, matching precise copper weight distribution to ensure impedance stability and flatness.

- L1: 0.5oz base copper + electroplated copper

- CORE: 0.1mm (4mil)

- L2: 0.5oz copper

- PP: 106 + 1080 (3.95mil)

- L3: 1oz copper

- CORE: 0.36mm (14.17mil)

- L4: 1oz copper

- PP: 1080 + 1080 (4.83mil)

- L5: 1oz copper

- CORE: 0.1mm (4mil)

- L6: 1oz copper

- PP: 1080 + 1080 (4.83mil)

- L7: 1oz copper

- CORE: 0.36mm (14.17mil)

- L8: 1oz copper

- PP: 106 + 1080 (3.95mil)

- L9: 0.5oz copper

- CORE: 0.1mm (4mil)

- L10: 0.5oz base copper + electroplated copper

Precise Controlled Impedance Calculation Data

All signal lines are adjusted by precise line width and spacing to meet standard single-ended and differential impedance values, with verified dielectric thickness and dielectric constant parameters.

Outer Layer L1 / L10 Impedance

- 50Ω Single-ended: Adjust from 6mil to 5.5mil, Impedance = 50.3Ω (H1=4mil, Er1=4.25)

- 100Ω Differential: Adjust from 4/6mil to 3.5/6.5mil, Impedance = 99.4Ω (H1=4mil, Er1=4.25)

- 90Ω Differential: Adjust from 4.9/5.1mil to 4.3/5.7mil, Impedance = 90.3Ω (H1=4mil, Er1=4.25)

Inner Layer L3 / L4 / L7 / L8 Impedance

- 50Ω Single-ended: Adjust from 4.5mil to 5mil, Impedance = 49.2Ω (H1=20.25mil, Er1=4.23; H2=5.2mil, Er2=3.93)

- 100Ω Differential: Adjust from 4.1/8.9mil to 4/9mil, Impedance = 98.0Ω

- 90Ω Differential: Adjust from 5.1/7.9mil to 5/8mil, Impedance = 88.2Ω

PCB Shielding Layer Design

Strict shielding layer matching ensures signal isolation, anti-interference and stable impedance performance:

- L1 signal shielding layer: L2

- L10 signal shielding layer: L9

- L3 / L4 signal shielding layer: L2 / L5

- L7 / L8 signal shielding layer: L6 / L9

Product Features

- Adopt high Tg IT180A FR4 material, excellent heat resistance and low thermal expansion

- Symmetrical 10-layer stackup effectively reduces PCB warpage

- Full controlled impedance tolerance meets high-speed signal integrity requirements

- ENIG surface finish provides good solderability, oxidation resistance and wire bonding performance

- Reasonable shielding layer design improves anti-EMI performance

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