N4000-13EPSI Datasheet
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N4000-13 EP & N4000-13 EP SI
High-Speed Multifunctional Epoxy
Laminate & Prepreg
Nelco N4000-13 EP is an enhanced epoxy resin system engineered for today’s lead-free requirements
where multiple solder reflow at temperatures approaching 260ºC are required. N4000-13 EP provides
enhanced thermal reliability without compromising the electrical and signal loss properties that
have made the Nelco N4000-13 product family the industry standard for demanding high speed / low
loss designs. N4000-13 EP SI is excellent for applications that require optimum signal integrity
and precise impedance control, while maintaining high CAF resistance and thermal reliability.
Key Features
Applications
UL file number: E36295
High-Speed Multifunctional Epoxy
Laminate & Prepreg
N4000-13 EP & N4000-13 EP SI
Tg >210ºC, outstanding thermal, electrical and signal loss properties
- Excellent thickness control for tight tolerance impedance applications
- Low Df and Dk allows for low signal distortion and faster signal propagation required by high
frequency (1 - 10 GHz) and high reliability applications
CAF resistant
- The low Z-CTE and improved CAF resistance provide long-term reliability for both RF and digital
applications
- Provides excellent CAF resistance even after multiple lead-free assembly exposures
Signal Integrity Option
- SI® glass available for low-loss applications and enhanced performance
Proprietary advanced resin technology
- Industry standard material with well documented dielectric constant and loss tangent properties
High-Tg FR-4 processing
- Identical processing to N4000-13, similar to traditional high Tg FR-4 materials
- 90 min press at 193ºC and 275-350 psi
Lead-Free Assembly Compatible
- Suitable for assemblies with a maximum reflow temperature of 260ºC 1
Available in a variety of constructions
- Available in a wide variety of constructions, copper weights and glass styles including very low
profile copper,
standard copper, double treat and RTFOIL®
- Available as a 2 mil core product meeting the specifications of a capacitive laminate
- Meets UL 94V-0 and IPC-4101/29 specifications
- RoHS compliant
Applications
- Fine-Line Multilayers
- Backplanes
- Surface-Mount Multilayers
- BGA Multilayers
- MCM-Ls
- CSP Attachment
- Wireless Communication Infrastructure
- High Speed Services
- High Speed Storage Networks
- Internet Switching /
- Routing Systems
Tracy
Tracy